Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTROMAGNETIC WAVE SHIELDING FILM AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/111254
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic wave shielding film comprising an insulating layer and a conductive adhesive layer and having an electromagnetic wave shielding ratio of 50 dB to 65 dB at a frequency of 1 GHz according to an ASTM 4935-1 method, wherein the conductive adhesive layer has a resistivity [ρd] value of 1.0E-04 to 3.7E-04 Ωcm under a condition where the conductive adhesive layer has a content of a conductive filler of 60-80% and has a thickness of 10μm. In the present invention, instead of employing a flame retardant as a component of a conductive adhesive layer, a conductive filler is adjusted in shape and content to increase the packing density thereof and to lower resistivity, thereby exhibiting excellent electromagnetic shielding performance, electrical conductivity, heat resistance, and mechanical properties.

More Like This:
Inventors:
PARK HANSUNG (KR)
PARK MIJUNG (KR)
KIM WONKYUM (KR)
KIM JINWOO (KR)
YUM TAEWOO (KR)
Application Number:
PCT/KR2016/009600
Publication Date:
June 29, 2017
Filing Date:
August 29, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DOOSAN CORP (KR)
International Classes:
H05K9/00; B32B7/12; B32B15/088; H05K1/02
Foreign References:
US20040172502A12004-09-02
US20080014528A12008-01-17
KR100995563B12010-11-19
US5366664A1994-11-22
KR20150083018A2015-07-16
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (KR)
Download PDF: