Title:
ELECTROMAGNETIC WAVE SHIELDING FILM AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/111158
Kind Code:
A1
Abstract:
An electromagnetic wave shielding film (1) is provided with: a shielding layer (2) configured from a first metal layer (5) having nickel as a primary component, and a second metal layer (6) having copper as a primary component; an adhesive layer (3) provided to the second-metal-layer (6)-side surface of the shielding layer (2); and a protective layer (4) provided to the first-metal-layer-side surface of the shielding layer (2). The average crystal grain size of the second metal layer (6) is 50-200 nm.
Inventors:
IWAI KIYOSHI (JP)
YANAGI YOSHIHARU (JP)
TSUJI TERUAKI (JP)
NISHIYAMA TAKESHI (JP)
FUJI NOBUO (JP)
YANAGI YOSHIHARU (JP)
TSUJI TERUAKI (JP)
NISHIYAMA TAKESHI (JP)
FUJI NOBUO (JP)
Application Number:
PCT/JP2016/088678
Publication Date:
June 29, 2017
Filing Date:
December 26, 2016
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
TORAY KP FILMS INC (JP)
TORAY KP FILMS INC (JP)
International Classes:
H05K9/00; B32B15/08
Domestic Patent References:
| WO2009019963A1 | 2009-02-12 |
Foreign References:
| JP2015523709A | 2015-08-13 | |||
| JP2013185163A | 2013-09-19 | |||
| JP2004128158A | 2004-04-22 | |||
| JP2006245452A | 2006-09-14 | |||
| JP2012512543A | 2012-05-31 | |||
| JP2013110335A | 2013-06-06 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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