Title:
ELECTROMAGNETIC-WAVE-SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2023/038097
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic-wave-shielding film having adequately high bending resistance, and adequately high electromagnetic-wave-shielding characteristics even when used in transmission circuits that transmit high-frequency-region signals. The electromagnetic-wave-shielding film according to the present invention comprises an adhesive layer, a shield layer laminated on the adhesive layer, and an insulation layer laminated on the shield layer, wherein said electromagnetic-wave-shielding film is characterized in that: a plurality of open portions having an open area of 1 to 5000 µm2 are formed on said shielding layer; the open portions include first open portions in which the open area exceeds 1 µm2 and is 300 µm2 or less, and second open portions in which the open area exceeds 300 µm2 and is 5000 µm2 or less; and the proportion of the open portions that are first open portions (cumulative frequency) is 30 to 90% , and the proportion of the open portions that are second open portions (cumulative frequency) is 10 to 70%.
Inventors:
KATSUKI TAKAHIKO (JP)
TAJIMA HIROSHI (JP)
ISHIOKA SOUGO (JP)
KAMINO KENJI (JP)
TAJIMA HIROSHI (JP)
ISHIOKA SOUGO (JP)
KAMINO KENJI (JP)
Application Number:
PCT/JP2022/033822
Publication Date:
March 16, 2023
Filing Date:
September 09, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025; B32B15/08
Foreign References:
| JP2021068884A | 2021-04-30 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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