Title:
ELECTROMAGNETIC WAVE-SUPPRESSING HEAT TRANSFER SHEET, METHOD FOR PRODUCING ELECTROMAGNETIC WAVE-SUPPRESSING HEAT TRANSFER SHEET, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/147228
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave-suppressing heat transfer sheet which exhibits high adhesion to a heat source or a heat dissipation member, while having excellent heat conductivity and electromagnetic wave suppression effect. In order to solve the above-described problem, an electromagnetic wave-suppressing heat transfer sheet 1 according to the present invention contains a binder resin 11 and a fibrous heat conductive filler 12, and is characterized in that this electromagnetic wave-suppressing heat transfer sheet 1 is obtained by connecting a vertically aligned body 10a, in which the heat conductive filler 12 is aligned in a direction T that is generally perpendicular to a sheet surface S, and a horizontally aligned body 10b, in which the heat conductive filler 12 is aligned in a direction that is generally parallel to the sheet surface S, with each other within the same plane.
Inventors:
KUMURA TATSUO (JP)
Application Number:
PCT/JP2018/003818
Publication Date:
August 16, 2018
Filing Date:
February 05, 2018
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H05K7/20; H01F1/28; H01L23/00; H01L23/36; H01L23/373; H05K9/00
Foreign References:
| JP2008159995A | 2008-07-10 | |||
| JP2002184916A | 2002-06-28 | |||
| JP2002093967A | 2002-03-29 | |||
| JP2015029075A | 2015-02-12 | |||
| JP2009238841A | 2009-10-15 | |||
| JP2012023335A | 2012-02-02 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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