Title:
ELECTROMAGNETICALLY COUPLED MODULE AND ARTICLE WITH ELECTROMAGNETICALLY COUPLED MODULE
Document Type and Number:
WIPO Patent Application WO/2008/050535
Kind Code:
A1
Abstract:
There are provided an electromagnetically coupled module to be used in wireless IC devices, and an article with an electromagnetically coupled module, capable of preventing adverse effects on environments and human bodies as much as possible. The electromagnetically coupled module (1A) comprises a wireless IC chip (5), and a power feeding circuit board (10) having a power feeding circuit (16), which is connected to the wireless IC chip (5) and includes an inductance element (L) and a capacitance element (C). The power feeding circuit board (10) is formed of a biodegradable plastic and prevents adverse effects on environments and human bodies as much as possible. This electromagnetically coupled module (1A) is attached to a radiation plate (20) and used as a wireless IC device for RFID systems.
Inventors:
KATO NOBORU (JP)
MURATA TSUNEO (JP)
MURATA TSUNEO (JP)
Application Number:
PCT/JP2007/066721
Publication Date:
May 02, 2008
Filing Date:
August 29, 2007
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KATO NOBORU (JP)
MURATA TSUNEO (JP)
KATO NOBORU (JP)
MURATA TSUNEO (JP)
International Classes:
G06K19/077; G06K19/07
Foreign References:
| JP2003187207A | 2003-07-04 | |||
| JPH08176421A | 1996-07-09 | |||
| JP3075400U | 2001-02-16 | |||
| JP2006203852A | 2006-08-03 |
Attorney, Agent or Firm:
MORISHITA, Takekazu et al. (2-18Minamihommachi 4-chome,Chuo-ku, Osaka-sh, Osaka 54, JP)
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