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Patent Searching and Data


Title:
ELECTRONIC AMPLIFICATION SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC AMPLIFICATION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/132909
Kind Code:
A1
Abstract:
This electronic amplification substrate (10) is provided with: a glass substrate (11) having insulating properties; conducting layers (12, 13) formed on both principal surfaces of the glass substrate (11); and a plurality of through-holes (15) formed in a laminated layer (14) of the glass substrate (11) and the conducting layers (12, 13), and is constituted such that an electrical field is formed within the through-holes (15) due to a potential difference between the two conducting layers when a voltage is applied to the conducting layer surfaces, giving rise to electron avalanche amplification within the through-holes, wherein on at least one of the principal surfaces of the glass substrate (11), insulating parts (20) are formed such that the openings of the through-holes (15) of the glass substrate (11) are surrounded by one end of the insulating parts, while the other ends contact ends (12a, 13a) of the conducting layers.

Inventors:
FUSHIE TAKASHI (JP)
Application Number:
PCT/JP2014/054284
Publication Date:
September 04, 2014
Filing Date:
February 24, 2014
Export Citation:
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Assignee:
HOYA CORP (JP)
International Classes:
H01J47/06; G01T1/18
Domestic Patent References:
WO2012073759A12012-06-07
Foreign References:
JP2001508935A2001-07-03
JP2008534950A2008-08-28
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
Ani store Setsuo (JP)
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