Title:
ELECTRONIC APPARATUS AND ELECTROMAGNETIC WAVE-SHIELDING HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2019/230607
Kind Code:
A1
Abstract:
An electronic apparatus according to an aspect of the present invention is provided with an electronic component, an electromagnetic wave-shielding heat dissipation sheet, and a case that accommodates the electronic component and the electromagnetic wave-shielding heat dissipation sheet, wherein the electromagnetic wave-shielding heat dissipation sheet is provided with a first heat conductive resin layer, a conductive layer, and a second heat conductive resin layer in this order, and is disposed such that the first heat conductive resin layer is in contact with the electromagnetic component and the second heat conductive resin layer is in contact with the case.
Inventors:
IGARASHI KAZUYUKI (JP)
NAKAJIMA GOHSUKE (JP)
NAKAJIMA GOHSUKE (JP)
Application Number:
PCT/JP2019/020743
Publication Date:
December 05, 2019
Filing Date:
May 24, 2019
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H05K7/20; B32B15/08; B32B27/00; B32B27/06; B32B27/20; H01L23/00; H01L23/36; H05K9/00
Foreign References:
| JP2001189582A | 2001-07-10 | |||
| JP2016186972A | 2016-10-27 | |||
| JP2003224386A | 2003-08-08 | |||
| JP2015153743A | 2015-08-24 | |||
| JPH11317591A | 1999-11-16 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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