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Patent Searching and Data


Title:
ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/126238
Kind Code:
A1
Abstract:
[Problem] To provide an electronic apparatus capable of further improving the stability of an electrical connection state between a wiring pad and a conductive pad that are in a mutually perpendicular relationship and a manufacturing method of the electronic apparatus. [Solution] The present invention comprises a substrate having a wiring pad formed on a first surface and a chip component having a conductive pad formed on a first surface, wherein the chip component is provided on the substrate such that the first surface of the chip component is substantially perpendicular to the first surface of the substrate, wherein a first bump is provided to electrically connect the wiring pad and the conductive pad with one another, wherein a second bump is provided to overlap with the wiring pad and at least a portion of the first bump, and wherein the second bump electrically connects the wiring pad and the first bump with one another.

Inventors:
HAYAKAWA YASUO (JP)
NAKAYAMA KENICHI (JP)
KAMIMURA HIDEKI (JP)
Application Number:
PCT/JP2016/085918
Publication Date:
July 27, 2017
Filing Date:
December 02, 2016
Export Citation:
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Assignee:
ALPS ELECTRIC CO LTD (JP)
International Classes:
H01L21/607
Foreign References:
JP2014096414A2014-05-22
JP2011258766A2011-12-22
Attorney, Agent or Firm:
NOZAKI, Teruo (JP)
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