ELECTRONIC APPARATUS, SEMICONDUCTOR DEVICE, INSULATING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Title:

ELECTRONIC APPARATUS, SEMICONDUCTOR DEVICE, INSULATING SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/162417

Kind Code:

A1

Abstract:

The present invention provides a structure in which a metal having fluidity is utilized as a heat conductive material. In this structure, a heat conductive material is prevented from invading an unintended region even when a positional change of a semiconductor device occurs or a vibration occurs. This electronic apparatus has a heat conductive material (31) formed between a heat radiator (50) and a semiconductor chip (11). The heat conductive material (31) has fluidity at least when the semiconductor chip (11) is in operation. The heat conductive material (31) has electroconductivity. The heat conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating section (15).

Inventors:

TSUCHIDA SHINYA (JP)
SABELSTROM NILS (JP)
MORISHITA MITSUHARU (JP)
HIROSE KENJI (JP)
HAYASHIBARA MASANORI (JP)
TAMURA TETSUJI (JP)
OONISHI SEI (JP)
SUGAWARA NOBUYUKI (JP)

Application Number:

PCT/JP2020/003993

Publication Date:

August 13, 2020

Filing Date:

February 03, 2020

Export Citation:

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Assignee:

SONY INTERACTIVE ENTERTAINMENT INC (JP)

International Classes:

H01L23/36; H01L23/40; H05K7/20

Foreign References:

JP2001267473A	2001-09-28
JP3116877U	2005-12-22
JP2007243106A	2007-09-20
JP2003229517A	2003-08-15
JP2003152149A	2003-05-23
JP2012069902A	2012-04-05
JP2007335742A	2007-12-27

Other References: