Title:
ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2002/087297
Kind Code:
A1
Abstract:
An electronic apparatus provided by a quite novel solder connection, specifically, a flip chip connection implemented on a high-temperature side in a temperature hierarchy connection, in place of a high-lead solder containing much lead. A constitution, in which metal balls (6) containing a single metal, an alloy, a compound or a mixture of them are linked together by either Sn or In, is used for electrodes (3), (4) between a chip (1) and a substrate (2) to implement the above flip chip connection.
Inventors:
HATA HANAE (JP)
SOGA TASAO (JP)
ISHIDA TOSHIHARU (JP)
MIURA KAZUMA (JP)
SOGA TASAO (JP)
ISHIDA TOSHIHARU (JP)
MIURA KAZUMA (JP)
Application Number:
PCT/JP2002/003676
Publication Date:
October 31, 2002
Filing Date:
April 12, 2002
Export Citation:
Assignee:
HITACHI LTD (JP)
HATA HANAE (JP)
SOGA TASAO (JP)
ISHIDA TOSHIHARU (JP)
MIURA KAZUMA (JP)
HATA HANAE (JP)
SOGA TASAO (JP)
ISHIDA TOSHIHARU (JP)
MIURA KAZUMA (JP)
International Classes:
B23K3/06; B23K35/26; C23C28/02; B23K1/00; C23C30/00; H01L21/48; H01L23/498; H05K3/34; B23K35/02; B23K101/42; H01L23/31; (IPC1-7): H05K3/34; B23K1/00; B23K3/06; H05K1/18; H01L21/60
Domestic Patent References:
| WO1997012718A1 | 1997-04-10 |
Foreign References:
| JPH10303548A | 1998-11-13 | |||
| JP2000223831A | 2000-08-11 | |||
| JP2000323511A | 2000-11-24 | |||
| JP2000223514A | 2000-08-11 |
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)
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