Title:
ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/021262
Kind Code:
A1
Abstract:
Provided is an electronic apparatus provided with a new means capable of suppressing temperature increases in a heat emitting component. The electronic apparatus (20), which is provided with a heat emitting part, has a device (or a chemical heat pump) (10) comprising: a reaction chamber (1) which houses a chemical heat storage material which exhibits an endothermic reaction in response to heat emitted by the heat emitting part (11); a condensation/evaporation chamber (3) for either condensing or evaporating condensable components generated from the endothermic reaction of the chemical heat storage material; and a communication part (5) which communicates between the reaction chamber (1) and the condensation/evaporation chamber (3) such that the condensable components are capable of moving between the reaction chamber (1) and the condensation/evaporation chamber (3).
Inventors:
MIURA TADAMASA (JP)
YAMASHITA YOSHIYUKI (JP)
OGURA HIRONAO (JP)
YAMASHITA YOSHIYUKI (JP)
OGURA HIRONAO (JP)
Application Number:
PCT/JP2013/070478
Publication Date:
February 06, 2014
Filing Date:
July 29, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
UNIV CHIBA NAT UNIV CORP (JP)
UNIV CHIBA NAT UNIV CORP (JP)
International Classes:
H05K7/20; F28D20/00; F25B17/08
Foreign References:
| JP2005036197A | 2005-02-10 | |||
| JP2009228951A | 2009-10-08 | |||
| JP2008111592A | 2008-05-15 | |||
| JP2010043804A | 2010-02-25 | |||
| JP2002031426A | 2002-01-31 | |||
| JP2003114067A | 2003-04-18 | |||
| JP2010216772A | 2010-09-30 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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