Title:
ELECTRONIC ASSEMBLY COMPRISING AN IMPROVED SINTER CONNECTION
Document Type and Number:
WIPO Patent Application WO/2012/079855
Kind Code:
A3
Abstract:
The invention relates to an electronic assembly comprising a base part (2), in particular a substrate, at least one electronic component (3), in particular a chip that is located on the base part (2), and a sinter connection (4) that connects the electronic component (3) to the base part (2). The sinter connection (4) is provided in two-dimensional form between the base part (2) and the electronic component (3) and one edge (3) of the component is at least partially devoid of the sinter connection (4). This measure achieves a significantly improved thermal shock resistance for the electronic component, as local voltage spikes that would exceed the breaking stress are reduced by being distributed over a larger area of the surface. The sinter connection (4) can have an edge region comprising a plurality of open (5) cavities (50) or cavities closed around their periphery or a recess (45) on the edge region of a side facing the electronic component (3). At least one cavity (6) is provided in the base part (2) and the sinter connection (4) runs up to said cavity. The sinter connection (4) can comprise a two-dimensional intermediate element with excellent electrical and thermal conductivity.
Inventors:
WOLDE-GIORGIS DANIEL (DE)
KALICH THOMAS (DE)
SUESKE ERIK (DE)
KALICH THOMAS (DE)
SUESKE ERIK (DE)
Application Number:
PCT/EP2011/069662
Publication Date:
September 20, 2012
Filing Date:
November 08, 2011
Export Citation:
Assignee:
BOSCH GMBH ROBERT (DE)
WOLDE-GIORGIS DANIEL (DE)
KALICH THOMAS (DE)
SUESKE ERIK (DE)
WOLDE-GIORGIS DANIEL (DE)
KALICH THOMAS (DE)
SUESKE ERIK (DE)
International Classes:
H01L23/492; H01L21/60; H01L23/13; H01L23/495
Domestic Patent References:
| WO2009131217A1 | 2009-10-29 |
Foreign References:
| EP2075835A2 | 2009-07-01 | |||
| JP2005093803A | 2005-04-07 | |||
| EP1089334A2 | 2001-04-04 | |||
| JP2003017627A | 2003-01-17 | |||
| EP1995772A1 | 2008-11-26 | |||
| JP2007235059A | 2007-09-13 | |||
| EP0242626A2 | 1987-10-28 |
Other References:
BAI J G ET AL: "Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices", IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, IEEE, PISCATAWAY, NY, US, vol. 30, no. 4, October 2007 (2007-10-01), pages 241 - 245, XP011192995, ISSN: 1521-334X, DOI: 10.1109/TEPM.2007.906508
Attorney, Agent or Firm:
ROBERT BOSCH GMBH (Stuttgart, DE)
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