Title:
ELECTRONIC ASSEMBLY PACKAGE MEMBER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/041390
Kind Code:
A1
Abstract:
Provided are an electronic assembly package member (1) and a manufacturing method therefor. The electronic assembly package member (1) comprises: a first metal layer, a high-voltage transistor semiconductor die (10), a first molding compound layer (11), a second metal layer, a first vertical connection structure, a second vertical connection structure, a control circuit die (12), and a second molding compound layer (13). According to the electronic assembly package member (1), a lead frame and a wire are replaced with the metal layers and the vertical connection structures, so that the electrical connection position of chips is flexible, and a heat dissipation effect is good. The present invention is suitable for packaging high-voltage or high-current chips.
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Inventors:
LIN SHIAU-SHI (CN)
Application Number:
PCT/CN2023/112139
Publication Date:
February 29, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
DIODES INC (US)
International Classes:
H01L23/48; H01L21/60
Foreign References:
| CN115295500A | 2022-11-04 | |||
| US20220093573A1 | 2022-03-24 | |||
| CN103441124A | 2013-12-11 | |||
| CN106328624A | 2017-01-11 | |||
| DE102014103403A1 | 2014-09-18 | |||
| KR20220085511A | 2022-06-22 | |||
| US20140231887A1 | 2014-08-21 | |||
| US20150130048A1 | 2015-05-14 | |||
| US20200364600A1 | 2020-11-19 |
Attorney, Agent or Firm:
LEE AND LI-LEAVEN IPR AGENCY LTD. (CN)
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