Title:
ELECTRONIC CIRCUIT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/041756
Kind Code:
A1
Abstract:
According to the present invention, in an electronic circuit apparatus having a shunt resistor, heat dissipation of the shunt resistor is improved. The shunt resistor (12) has electrodes (12a, 12b) at both ends. A surface-mount pattern (13R) for surface-mounting the shunt resistor (12) is connected to one electrode (12b). A current-generation side pattern (16) and a current-intake side pattern (17) are arranged separated from the surface-mount pattern (13R). The current-generation side pattern (16) and the surface-mount pattern (13R) are connected by a connecting member (20) separated by a space from the substrate.
Inventors:
KONDOU REI
TANAKA MITSUHIRO
KOYAMA YOSHITSUGU
TANAKA MITSUHIRO
KOYAMA YOSHITSUGU
Application Number:
PCT/JP2013/005150
Publication Date:
March 20, 2014
Filing Date:
August 30, 2013
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
H01C13/00; H01C1/084
Foreign References:
| JP2008294021A | 2008-12-04 | |||
| JP2005164469A | 2005-06-23 | |||
| JPH0883969A | 1996-03-26 | |||
| JP2011155134A | 2011-08-11 | |||
| JP2012119507A | 2012-06-21 | |||
| JP2009010082A | 2009-01-15 |
Other References:
See also references of EP 2897138A4
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
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