Title:
ELECTRONIC CIRCUIT BOARD, LAMINATED BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/208043
Kind Code:
A1
Abstract:
Provided are: an electronic circuit board having reduced sizes by improving the mounting density of electronic components; a laminated board; and a method for manufacturing the electronic circuit board. An electronic circuit board 100 of the present invention is characterized by being provided with: a plurality of electronic components 40a-40d; and a board-like silicon substrate 20, which has a wiring pattern that is formed on the front surface and/or rear surface, and recessed sections 21a-21d in which the electronic components 40a-40d are separately mounted. The electronic circuit board is also characterized in that: the side surfaces of the recessed sections 21a-21d are perpendicular to the front surface of the silicon substrate 20; and the wiring pattern is connected to the electronic components 40a-40d via vias 31a-31d and/or bottom surface electrodes formed in the recessed sections 21a-21d, said electronic components being mounted in the recessed sections 21a-21d.
Inventors:
SUYAMA TAKURO (JP)
Application Number:
PCT/JP2015/068422
Publication Date:
December 29, 2016
Filing Date:
June 25, 2015
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
H05K1/18; A61B1/04; H01L23/12
Foreign References:
| JP2005317585A | 2005-11-10 | |||
| JP2005116943A | 2005-04-28 | |||
| JP2011228335A | 2011-11-10 | |||
| JP2003209129A | 2003-07-25 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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