Title:
ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/012849
Kind Code:
A1
Abstract:
Provided is an electronic circuit board which allows positional shifting when mounting an electronic component to be prevented with high precision without requiring the presence of excess space in the surroundings of the electronic component. The electronic circuit board 100 comprises a printed circuit board 10 and an electronic component 20. The printed circuit board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bonding section 24 to be soldered to the first land 11 and a second bonding section 25 to be soldered to the second land 12. The surface area of the bond between the first land 11 and the first bonding section 24 is larger than the surface area of the bond between the second land 12 and the second bonding section 25. In one direction D1, the position of an outer edge 24b of the first bonding section 24 is aligned with the position of an outer edge 11b of the first land 11.
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Inventors:
TAKASE KOUSUKE (JP)
HONDA ISAMU (JP)
MUTO KIMINORI (JP)
TOMARU YUKA (JP)
HONDA ISAMU (JP)
MUTO KIMINORI (JP)
TOMARU YUKA (JP)
Application Number:
PCT/JP2018/021133
Publication Date:
January 17, 2019
Filing Date:
June 01, 2018
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01L23/50; H05K3/34; H05K1/18
Foreign References:
| JPS602873U | 1985-01-10 | |||
| JP2003273297A | 2003-09-26 | |||
| JP2005340684A | 2005-12-08 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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