ELECTRONIC CIRCUIT COMPONENT MOUNTER

WIPO Patent Application WO/2013/118565

A1

In order to improve an electronic circuit component mounter for which a component supply device and a mounting head are moved together with respect to a substrate holding device, a cover (600), which surrounds a movement path wherein each of twelve suction nozzles moves from a removal position to an imaging position, is provided on a head main body (186), and even if electronic circuit components removed from a component supply device (360) detach from the suction nozzles, the electronic circuit components are prevented from falling outside of the mounting head. Dropped components are guided to a dropped component guide path (632) by means of an inclined surface (616) and are collected, and the number of collected components is counted on the basis of imaging by means of a line sensor (670), and the dropping of components inside the mounting head is confirmed by a comparison with respect to the number of dropped components obtained by capturing, by means of a component imaging device, an image of the state of the adsorption of the components by the suction nozzles. An opening/closing member (630) on a component storage device is opened, and the collected components are discharged from an aperture (660).

NOZAWA MIZUHO (JP)

PCT/JP2013/050969

August 15, 2013

January 18, 2013

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FUJI MACHINE MFG (JP)

H05K13/04; H05K13/02

JP2008227249A	2008-09-25
JP2003347793A	2003-12-05
JP2005129631A	2005-05-19
JP2008270332A	2008-11-06
JP2000107956A	2000-04-18
JP2008135607A	2008-06-12
JPH03256622A	1991-11-15
JP2009117780A	2009-05-28

CHUBU PATENT OFFICE (JP)
Central patent business corporation international patent firm (JP)

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