Title:
ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE EQUIPPED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2022/224648
Kind Code:
A1
Abstract:
Provided is a compact electronic circuit equipped with a heat-dissipating component. An electronic circuit (110) is equipped with: a power source substrate (20) which has a first main surface (20a) and has a capacitor installed on the first main surface (20a); a power module (40) which has a heat-dissipating surface and is connected to the power source substrate (20); and a heat-dissipating plate (50) provided to the heat-dissipating surface of the power module (40). The power module (40) also has a terminal-forming surface which is located on the side thereof opposite the heat-dissipating surface and has a pair of terminals positioned thereon which include an output-side terminal and an input-side terminal. The heat-dissipating surface is positioned so as to be perpendicular to the first main surface (20a).
Inventors:
TSUKADA SHOTA
MORITA SHINJI
MORITA SHINJI
Application Number:
PCT/JP2022/012129
Publication Date:
October 27, 2022
Filing Date:
March 17, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H02M7/04; H02M7/48
Foreign References:
| JP2018198508A | 2018-12-13 | |||
| JP2011077463A | 2011-04-14 | |||
| JP2001036003A | 2001-02-09 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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