Title:
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR PRODUCING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/181626
Kind Code:
A1
Abstract:
According to the present invention, a land (22) and a wiring pattern (25a) are formed on a component mounting surface (3A) of a circuit board (3); and the wiring pattern (25a) is covered by a solder resist layer (26). An electrode part (21c) of an aluminum electrolytic capacitor (21) is soldered to the land (22), with a solder (27) being interposed therebetween. An intermediate bonding film (24a), which is composed of a part of a silk pattern (24), is printed on the solder resist layer (26); and the aluminum electrolytic capacitor (21) is bonded to the intermediate bonding film (24a) by means of a thermosetting adhesive (23). The stress of the adhesive (23) at the time of thermal shrinkage is attenuated by means of the intermediate bonding film (24a).
Inventors:
MUTO KIMINORI (JP)
Application Number:
PCT/JP2019/009849
Publication Date:
September 26, 2019
Filing Date:
March 12, 2019
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H05K3/34; H05K3/00
Domestic Patent References:
| WO2014119379A1 | 2014-08-07 |
Foreign References:
| JPS5726379Y2 | 1982-06-08 | |||
| JPS5837178U | 1983-03-10 | |||
| JP2005116894A | 2005-04-28 | |||
| JPH06216513A | 1994-08-05 |
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
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