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Patent Searching and Data


Title:
ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/092926
Kind Code:
A1
Abstract:
Provided is an electronic circuit device having the effect of a parasitic inductance reduced as much as possible and excellent in heat dissipation properties. This electronic circuit device (1) is formed such that: circuit elements (11-12, C2) including a switching element are mounted on a first principal surface (PCB1) of a circuit board (PCB) along a predetermined direction; first wiring patterns (P1, P2, P4, P6) that include virtual shortest current paths for connecting the respective circuit elements (11-12, C2) along the direction are formed; a second wiring pattern (P5) including facing current paths facing the formation regions of the virtual shortest current paths is formed on a second principal surface (PCB2); vias (V1, V2) and heat transfer vias (V11, V12) are provided, said vias (V1, V2) electrically connecting the first and second wiring patterns, said heat transfer vias (V11, V12) connecting a switching element (11-12) mounting region of the first principal surface (PCB1) and a facing current path side-portion region of the second principal surface (PCB2); and a heat dissipation member (20) touches the second principal surface (PCB2).

Inventors:
OKAGAWA YUUSUKE (JP)
Application Number:
PCT/JP2018/026859
Publication Date:
May 16, 2019
Filing Date:
July 18, 2018
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H02M3/155; H05K1/02
Foreign References:
JP2016503963A2016-02-08
JP2012186421A2012-09-27
Attorney, Agent or Firm:
SUNCREST PATENT AND TRADEMARK ATTORNEYS (JP)
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