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Patent Searching and Data


Title:
ELECTRONIC CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2016/151762
Kind Code:
A1
Abstract:
This electronic circuit module (100F) is provided with: a substrate (10) on which a wiring pattern including an electrode part (11) is formed; a cable (20) at least an end of which is a conductive part (23) from which an exterior insulating body has been removed to expose a conductor (23), the cable (20) being connected to the electrode part (11) via the conductive part (23); and an electronic component (30) having a terminal on at least an opposing surface. The terminal of the electronic component (30) is directly connected to the conductive part (23) from which the external insulating material has been removed.

Inventors:
YAMADA JUNYA (JP)
Application Number:
JP2015/058930
Publication Date:
September 29, 2016
Filing Date:
March 24, 2015
Export Citation:
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Assignee:
OLYMPUS CORP (?1510072, JP)
International Classes:
H01R12/50; H01R9/05; H01R13/646; H01R31/08; H05K1/18; H05K7/00
Foreign References:
JPS6311745Y21988-04-05
JP2011119409A2011-06-16
JP2013051136A2013-03-14
JP3000448U1994-08-09
JP3596480B22004-12-02
JP2003009368A2003-01-10
JPH05327169A1993-12-10
Attorney, Agent or Firm:
SAKAI, HIROAKI (?1000013, JP)
Hiroaki Sakai (?1000013, JP)
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