Title:
ELECTRONIC CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2022/215372
Kind Code:
A1
Abstract:
Provided is an electronic circuit module in which position and attitude discrepancies of a second electronic component are suppressed. An electronic circuit module according to the present invention is provided with: a board; a first electronic component mounted on one main surface of the board; a board electrode provided on said one main surface; a second electronic component supported on a supporting surface on the opposite side of the first electronic component to a surface thereof facing said one surface; a component electrode provided on a surface of the second electronic component; and a conductor including a connecting portion connecting the board electrode and the component electrode. The second electronic component has a conductive portion which is electrically connected to the component electrode. The conductive portion is separated from the supporting surface of the first electronic component.
Inventors:
OTSUBO YOSHIHITO (JP)
OIE HIROFUMI (JP)
OIE HIROFUMI (JP)
Application Number:
PCT/JP2022/006914
Publication Date:
October 13, 2022
Filing Date:
February 21, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18; H05K1/02; H05K1/14; H05K1/18; H05K7/20; H05K9/00
Foreign References:
| JP2017092291A | 2017-05-25 | |||
| JP2009231383A | 2009-10-08 | |||
| US20060035258A1 | 2006-02-16 | |||
| US20100140777A1 | 2010-06-10 | |||
| US20200091093A1 | 2020-03-19 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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