Title:
ELECTRONIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2019/187013
Kind Code:
A1
Abstract:
An electronic circuit to which the present invention is applied has a structure in which a first substrate and a second substrate are laid one on the other and connected to each other. The electronic circuit includes: a transmission path connecting between a first interconnect for signals formed on the first substrate and a second interconnect for signals formed on the second substrate; and a short-circuited stub connecting a grounding conductor provided on the first substrate and the transmission path by at least three types of conductors.
Inventors:
WATANABE MOTOMI (JP)
Application Number:
PCT/JP2018/013634
Publication Date:
October 03, 2019
Filing Date:
March 30, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01P5/02
Domestic Patent References:
| WO2018029846A1 | 2018-02-15 |
Foreign References:
| JP2017121032A | 2017-07-06 | |||
| JP2004146810A | 2004-05-20 | |||
| JP2013098888A | 2013-05-20 | |||
| JP2012520652A | 2012-09-06 |
Other References:
See also references of EP 3758136A4
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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