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Patent Searching and Data


Title:
ELECTRONIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2019/187013
Kind Code:
A1
Abstract:
An electronic circuit to which the present invention is applied has a structure in which a first substrate and a second substrate are laid one on the other and connected to each other. The electronic circuit includes: a transmission path connecting between a first interconnect for signals formed on the first substrate and a second interconnect for signals formed on the second substrate; and a short-circuited stub connecting a grounding conductor provided on the first substrate and the transmission path by at least three types of conductors.

Inventors:
WATANABE, Motomi (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2018/013634
Publication Date:
October 03, 2019
Filing Date:
March 30, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
H01P5/02
Domestic Patent References:
WO2018029846A12018-02-15
Foreign References:
JP2017121032A2017-07-06
JP2004146810A2004-05-20
Attorney, Agent or Firm:
SOGA, Michiharu et al. (S. Soga & Co, 8th Floor Kokusai Building, 1-1, Marunouchi 3-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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