Title:
ELECTRONIC COMPONENT ACCOMMODATING PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/208999
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electronic component accommodating package which, when being sealed with a lid, prevents sealing wax material from entering an area in which an electronic component or the like is mounted and causing a short circuit or the like. The electronic component accommodating package (1) comprises a base portion (2) having a first major surface (2a) on which a frame portion (3) is stacked, wherein the frame portion (3) has a second major surface (3b) on which a frame-like metallization layer (4) is formed. A non-metallization layer-formed surface (3d) is formed around an upper-end surface (5a) of a side-surface conductor (5) embedded in a corner portion of the frame portion (3). An insulating material (6) is formed so as to cover a boundary line (7) along which the upper-end surface (5a) and the side wall (4a) of the frame-like metallization layer (4) adjoin each other.
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Inventors:
NISHIKAWA KATSUHIRO (JP)
Application Number:
PCT/JP2020/010914
Publication Date:
October 15, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
NGK ELECTRONICS DEVICES INC (JP)
NGK INSULATORS LTD (JP)
NGK INSULATORS LTD (JP)
International Classes:
H01L23/02; H01L23/10; H03H9/02
Foreign References:
| JP2018152585A | 2018-09-27 | |||
| JP2000312060A | 2000-11-07 | |||
| JP2011009399A | 2011-01-13 |
Attorney, Agent or Firm:
INOUE Hiroshi (JP)
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