Title:
ELECTRONIC COMPONENT, ADHESIVE SHEET, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/185827
Kind Code:
A1
Abstract:
According to one embodiment of the present invention, an electronic component is provided with: a flexible printed wiring board; one or a plurality of conductive boards overlapping one or a plurality of conductive regions; and a conductive adhesive layer applied to the one or a plurality of adhesive regions. The conductive adhesive layer has, in each of the conductive regions, one or a plurality of bumps, and an adhesive layer applied to around the one or the plurality of bumps, and the shortest distance between the one or the plurality of bumps and an outer end of the adhesive regions including the one or the plurality of bumps is equal to or shorter than 2.4 mm.
Inventors:
HASHIZUME KAYO (JP)
YAMAMOTO MASAMICHI (JP)
UCHITA YOSHIFUMI (JP)
KIYA SATOSHI (JP)
YAMAMOTO MASAMICHI (JP)
UCHITA YOSHIFUMI (JP)
KIYA SATOSHI (JP)
Application Number:
PCT/JP2016/061523
Publication Date:
November 24, 2016
Filing Date:
April 08, 2016
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/02; H05K1/18; H05K3/32
Foreign References:
| JP2015023065A | 2015-02-02 | |||
| JPS6452247U | 1989-03-31 | |||
| JP2006080156A | 2006-03-23 | |||
| JP2009218443A | 2009-09-24 |
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
中田 元己 (JP)
中田 元己 (JP)
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