ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS IN WHICH THE ELECTRONIC COMPONENT IS MOUNTED AND ITS MANUFACTURING METHOD

Title:

ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS IN WHICH THE ELECTRONIC COMPONENT IS MOUNTED AND ITS MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2000/075940

Kind Code:

A1

Abstract:

An electronic component which is friendly to the global environment and which possesses improved reliability of the junction between external terminals of the electronic component and a circuit pattern on a printed circuit board. An electronic apparatus in which the electronic component is mounted and a method of its manufacture are disclosed. The electronic component has lead wires the outermost layer of which is an Sn-Cu alloy layer or has external terminals the outermost layer of which is an Sn-Cu alloy layer. The method of manufacturing the electronic apparatus includes a step of electrically connecting the electronic component to a desired pattern on a printed wiring board by means of an Sn-Cu alloy layer.

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Inventors:

NAKAMURA TSUNESHI (JP)
YOSHIDA AKIO (JP)
USHIO NORIKI (JP)
KURIBAYASHI TAKASHI (JP)
YAMAZOE TOSHIHIRO (JP)
KAKINOKI YOSHIAKI (JP)

Application Number:

PCT/JP2000/003682

Publication Date:

December 14, 2000

Filing Date:

June 07, 2000

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD (JP)
NAKAMURA TSUNESHI (JP)
YOSHIDA AKIO (JP)
USHIO NORIKI (JP)
KURIBAYASHI TAKASHI (JP)
YAMAZOE TOSHIHIRO (JP)
KAKINOKI YOSHIAKI (JP)

International Classes:

B23K35/26; C22C13/00; H01C1/14; H01C17/28; H01F27/29; H01L23/50; H05K3/34; (IPC1-7): H01G4/228; B23K35/26; H01C17/28; H01F27/29; H01F41/04; H05K3/34

Foreign References:

JPH10286688A	1998-10-27
JPH10214706A	1998-08-11
JPH0745666A	1995-02-14

Other References: