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Title:
ELECTRONIC-COMPONENT ASSEMBLY STRUCTURE, JUNCTION BOX AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/142249
Kind Code:
A1
Abstract:
An electronic-component assembly structure equipped with a rectangular component body, an electronic component having lead terminals projecting from component-body lateral surfaces, and a storage member which has the electronic component inserted thereinto and stored therein, and holds terminal fittings for connecting the lead terminals, wherein the electronic component, the terminal fittings and the storage member are assembled with one another as a result of: the lead terminals being provided with base-end sections projecting from component-body lateral surfaces, and connecting sections which are contiguous with the base-end sections and extend downward along the lateral surfaces of the component body; the lead terminals being provided on component-body lateral surfaces so as to project therefrom in the widthwise direction of the lateral surfaces; the storage member being provided with a first storage chamber for guiding and storing the component body, and second storage chambers for storing and holding terminal fittings to which connecting sections connect; the first storage chamber being formed so as to be surrounded on four sides by wall sections extending upward from a floor wall; the second storage chambers being formed on the outside of the wall sections of the first storage chamber; and insulating members which project from the component-body lateral surfaces which face adjacent base-end sections being formed in the thickness direction of the base-end-section lateral surfaces on the component-body lateral surfaces on which the lead terminals are provided. Consequently, it is possible to prevent short-circuiting between the lead terminals of an electronic component.

Inventors:
KAWAMURA YUKIHIRO (JP)
Application Number:
PCT/JP2014/056700
Publication Date:
September 18, 2014
Filing Date:
March 13, 2014
Export Citation:
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Assignee:
YAZAKI CORP (JP)
International Classes:
H02G3/16; B60R16/02; H01R9/22; H01R13/46; H01R33/74; H01R33/88
Foreign References:
JPS5557946U1980-04-19
JP2004336973A2004-11-25
US20130043971A12013-02-21
Attorney, Agent or Firm:
TORANOMON-IP FIRM (JP)
Patent business corporation Toranomon intellectual property office (JP)
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