Title:
ELECTRONIC COMPONENT, BONDING STRUCTURE, POWER SUPPLY DEVICE, AND ELECTRIC VEHICLE
Document Type and Number:
WIPO Patent Application WO/2018/012065
Kind Code:
A1
Abstract:
This electronic component has a secondary coil configured from a plurality of coil sections, and each of the coil sections has a board-like base section, a leg section formed on the base section, and a pin section formed at the leading end of the leg section.
Inventors:
NAKAZAWA HIROHUMI (JP)
Application Number:
PCT/JP2017/014612
Publication Date:
January 18, 2018
Filing Date:
April 10, 2017
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01F30/10; H01F27/28
Foreign References:
| JP2014233192A | 2014-12-11 | |||
| JPH0738260A | 1995-02-07 | |||
| JP2009032992A | 2009-02-12 |
Other References:
See also references of EP 3483904A4
Attorney, Agent or Firm:
SUGIURA, Masatomo et al. (JP)
Download PDF: