ELECTRONIC COMPONENT, CAMERA MODULE, AND ELECTRONIC COMPONENT PRODUCTION METHOD

Title:

ELECTRONIC COMPONENT, CAMERA MODULE, AND ELECTRONIC COMPONENT PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2018/142834

Kind Code:

A1

Abstract:

[Problem] To enable downsizing of a structure and suppress deterioration of image quality. [Solution] Provided is an electronic component comprising: a circuit board having a first surface, a second surface on a side opposite to the first surface, and a first opening section; a translucent member provided opposite the first surface of the circuit board; an image capturing element flip-chip mounted on the second surface of the circuit board and having a light-receiving surface on a side opposing the translucent member; and a light-absorbing member provided between the circuit board and the translucent member, and formed in a region of the first surface of the circuit board excluding the first opening section in a plan view.

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Inventors:

MOMIUCHI YUTA (JP)
ITOTANI RYO (JP)
NAKAYAMA HIROKAZU (JP)
KAI TOORU (JP)
TOGAWA MIYOSHI (JP)

Application Number:

PCT/JP2017/047355

Publication Date:

August 09, 2018

Filing Date:

December 28, 2017

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H04N5/225; G03B17/02; H04N5/359

Foreign References:

JP2014216973A	2014-11-17
JP2008103957A	2008-05-01
JP2001292354A	2001-10-19
JP2001128072A	2001-05-11

Attorney, Agent or Firm:

KAMEYA, Yoshiaki et al. (JP)

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