Title:
ELECTRONIC COMPONENT CARRIER SHEET, AND ADHESION DEVICE AND THIN FILM FORMING APPARATUS USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/199507
Kind Code:
A1
Abstract:
The present invention provides an electronic component carrier sheet, and an adhesion device and a thin film forming apparatus using the same, the electronic component carrier sheet allowing electronic components to be attached thereto so as to form a thin film on the surface of the electronic component while cooling the electronic component.
Inventors:
HEO JIN (KR)
HAN KYU MIN (KR)
LEE JIN SEON (KR)
JUNG YU SUP (KR)
YANG WON SEOK (KR)
LEE HO CHEOL (KR)
LEE MIN JIN (KR)
HAN KYU MIN (KR)
LEE JIN SEON (KR)
JUNG YU SUP (KR)
YANG WON SEOK (KR)
LEE HO CHEOL (KR)
LEE MIN JIN (KR)
Application Number:
PCT/KR2018/004137
Publication Date:
November 01, 2018
Filing Date:
April 09, 2018
Export Citation:
Assignee:
CNI TECH INC (KR)
International Classes:
H01L23/552; C23C14/34; C23C14/50; C23C14/54; C23C14/58; H01J37/34; H01L21/67; H01L23/00; H01L23/532
Foreign References:
| KR101712187B1 | 2017-03-13 | |||
| KR20100071201A | 2010-06-29 | |||
| KR20170040776A | 2017-04-13 | |||
| KR20140085232A | 2014-07-07 | |||
| KR20130128269A | 2013-11-26 |
Attorney, Agent or Firm:
AHN, Joon-Hyung et al. (KR)
Download PDF: