Title:
ELECTRONIC COMPONENT CLEANING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188128
Kind Code:
A1
Abstract:
The present invention is an electronic component cleaning device (100) that cleans wafer surfaces, wherein said electronic component cleaning device (100) comprises a wet cleaning unit (10), a dry cleaning unit (40), a conveyor unit, and a control unit (17). The control unit (17) performs wet cleaning of the surface of a wafer (80) in the wet cleaning unit (10), conveys the cleaned wafer (80) to the dry cleaning unit (40), performs dry cleaning of the surface of the wafer (80) using atmospheric pressure plasma in the dry cleaning unit (40), conveys the dry-cleaned wafer (80) to the wet cleaning unit (10), and performs a hydrogen water treatment in which which the surface of the wafer (80) is hydrophilized using hydrogen water obtained by dissolving hydrogen gas in water.
Inventors:
KIKUCHI HIROSHI (JP)
RI KINN (JP)
RI KINN (JP)
Application Number:
PCT/JP2022/016054
Publication Date:
October 05, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
YAMAHA ROBOTICS HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; B23K20/24; H01L21/02; H01L21/52; H01L21/677
Domestic Patent References:
| WO2021132133A1 | 2021-07-01 | |||
| WO2010021020A1 | 2010-02-25 |
Foreign References:
| JP2008518470A | 2008-05-29 | |||
| JP2012250232A | 2012-12-20 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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