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Title:
ELECTRONIC COMPONENT CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/188154
Kind Code:
A1
Abstract:
This electric component cleaning method for cleaning the surface of a wafer includes: wet cleaning steps (S102-S104) for performing wet cleaning of the surface of the wafer using hydrogen water and pure water; a dry cleaning step (S109), after the wet cleaning steps, for performing dry cleaning of the surface of an electronic component using an atmospheric-pressure plasma; and a hydrogen water processing step (S113), after the dry cleaning step, for cleaning the surface of the wafer using hydrogen water obtained by dissolving hydrogen gas in water.

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Inventors:
KIKUCHI HIROSHI (JP)
RI KINN (JP)
IDA JUNICHI (JP)
Application Number:
PCT/JP2022/016130
Publication Date:
October 05, 2023
Filing Date:
March 30, 2022
Export Citation:
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Assignee:
YAMAHA ROBOTICS HOLDINGS CO LTD (JP)
KURITA WATER IND LTD (JP)
International Classes:
H01L21/304; B23K20/24; H01L21/02; H01L21/52
Domestic Patent References:
WO2021132133A12021-07-01
WO2010021020A12010-02-25
Foreign References:
JP2008518470A2008-05-29
JP2012250232A2012-12-20
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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