Title:
ELECTRONIC COMPONENT CONNECTION STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/227785
Kind Code:
A1
Abstract:
The present application relates to the field of electrical connection structures and provides an electronic component connection structure and an electronic device, capable of reducing the space occupation of a connection structure in the lateral dimension, thereby reducing the occupation in the lateral space inside the electronic device, and facilitating reduction of the shape size of the electronic device. The electronic component connection structure comprises a connecting plate, a first element and a second element; the first element is connected to one side of the connecting plate; the second element is connected to the other side of the connecting plate; the vertical projection of the first element on a preset plane overlaps with the vertical projection of the second element on the preset plane; the preset plane is parallel to the plane where one side of the connecting plate is located; the distance between the first element and the second element in a direction perpendicular to the preset plane is greater than or equal to a threshold distance.
Inventors:
WANG YAN (CN)
GAO JIULIANG (CN)
GAO JIULIANG (CN)
Application Number:
PCT/CN2022/075892
Publication Date:
November 03, 2022
Filing Date:
February 10, 2022
Export Citation:
Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H01Q1/38; H05K9/00
Foreign References:
| CN107948355A | 2018-04-20 | |||
| TW200605770A | 2006-02-01 | |||
| CN208460973U | 2019-02-01 | |||
| CN2565233Y | 2003-08-06 | |||
| CN201830551U | 2011-05-11 | |||
| US20050017902A1 | 2005-01-27 |
Other References:
See also references of EP 4106105A4
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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