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Title:
ELECTRONIC-COMPONENT-CONTAINING PACKAGE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/129731
Kind Code:
A1
Abstract:
This electronic-component-containing package (1) comprises the following: a substrate (2) that has, on the upper surface thereof, a placement region (R) in which an electronic component (11) is placed; a frame (3) that is provided so as to enclose said placement region (R) on the upper surface of the substrate (2) and has a pass-through section (H) that opens to both the inside and the outside; and an I/O member (5) that is provided on the frame (3) so as to close off the pass-through section (H) thereof and has a plurality of wiring conductors (4) that extend both inside and outside the frame (3) and are electrically connected to the electronic component (11). Inside the region enclosed by the frame (3), the I/O member (5) has built-in via conductors (51) that are connected to the wiring conductors (4) and are positioned so as to coincide therewith. The I/O member (5) is also provided with a ground layer (52) at a distance from the via conductors (51) near the bottom ends thereof. This invention can improve high-frequency characteristics.

Inventors:
KAWAZU, Yoshiki (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2015/055355
Publication Date:
September 03, 2015
Filing Date:
February 25, 2015
Export Citation:
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Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
H01L23/04; H01L23/02; H01P5/02; H01S5/022
Domestic Patent References:
WO2009096542A12009-08-06
Foreign References:
JP2012151232A2012-08-09
JP2000164755A2000-06-16
JP2009158511A2009-07-16
Other References:
See also references of EP 3113218A4
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