Title:
ELECTRONIC COMPONENT COOLING DEVICE HAVING LAYERED CORRUGATED PLATE COOLING TOWER
Document Type and Number:
WIPO Patent Application WO/2020/218677
Kind Code:
A1
Abstract:
An electronic component cooling device having a layered corrugated plate cooling tower, according to the present invention, comprises: at least one cooling tower including a first corrugated plate on which a first crest and a first valley having a height difference therebetween are continuously arranged in a longitudinal direction, a second corrugated plate on which a second crest that is closest to the first valley and a second valley that is farthest from the first crest are continuously arranged in a longitudinal direction, and an air channel formed between the first and second corrugated in a longitudinal direction, so that a plurality of first and second corrugated plates are sequentially layered in the height direction; a heat pipe extending in a height direction so as to penetrate one side of the first and second corrugated plates; and an electrothermal block having electronic components located on the bottom surface thereof while connected to the heat pipe.
Inventors:
YOON KUK YOUNG (KR)
Application Number:
PCT/KR2019/008247
Publication Date:
October 29, 2020
Filing Date:
July 04, 2019
Export Citation:
Assignee:
ZALMAN TECH CO LTD (KR)
International Classes:
H05K7/20
Foreign References:
| KR20100091775A | 2010-08-19 | |||
| KR101610044B1 | 2016-04-20 | |||
| JP2018132237A | 2018-08-23 | |||
| KR200421435Y1 | 2006-07-14 | |||
| JP2009281696A | 2009-12-03 |
Attorney, Agent or Firm:
JUN, Sang Yoon (KR)
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