Title:
ELECTRONIC COMPONENT DETACHING APPARATUS AND ELECTRONIC COMPONENT DETACHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/178889
Kind Code:
A1
Abstract:
Provided are an electronic component detaching apparatus and an electronic component detaching method which, when detaching an electronic component from an adhesive sheet, enable proper detachment of the electronic component by reducing the load exerted on the electronic component. This electronic component detaching apparatus is provided with: an upward-thrusting tool that is disposed beneath an adhesive sheet pasted to an electronic component, that is equipped with an inclined surface disposed at a prescribed angle with respect to the adhesive sheet, and that thrusts upward the adhesive sheet and the electronic component through the inclined surface; a suction device for suctioning the electronic component; and a control device for detaching the electronic component from the adhesive sheet either by causing the electronic component thrusted upward by the upward-thrusting tool to be suctioned by the suction device or by causing the upward-thrusting tool to thrust upward the electronic component suctioned by the suction device and then moving the suction device having suctioned the electronic component in a direction away from the adhesive sheet.
More Like This:
| JP3999712 | Articulated robot |
| JPH07163017 | AUTOMATIC CARRYING SYSTEM |
| JP2006032529 | CONVEYANCE EQUIPMENT AND METHOD THEREOF |
Inventors:
OMI YOSHIFUMI (JP)
Application Number:
PCT/JP2019/008041
Publication Date:
September 10, 2020
Filing Date:
March 01, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H01L21/677
Foreign References:
| JP2010212509A | 2010-09-24 | |||
| JPH04188840A | 1992-07-07 | |||
| JPH07249674A | 1995-09-26 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
Download PDF: