Title:
ELECTRONIC COMPONENT DEVICE, HIGH FREQUENCY FRONT END CIRCUIT AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/123969
Kind Code:
A1
Abstract:
This electronic component device is provided with: an electronic component (20); a resin structure (10) which internally contains the electronic component (20) so that at least one main surface of the electronic component is exposed therefrom; a through electrode (121); and a first wiring layer (32a) and a second wiring layer (32b). The electronic component (20) comprises: an element (21); an internal electrode (23) which is contained within the element (21) and is connected to the first wiring layer (32a) and the second wiring layer (32b); and an adjusting electrode (27) which is provided at least in an adjusting region (25) in the element (21). The first wiring layer (32a) is continuously provided on the internal electrode (23), the adjusting region (25) and the resin structure (10); and the thermal expansion coefficient of the resin structure (10), the thermal expansion coefficient of the adjusting region (25) and the thermal expansion coefficient of the internal electrode (23) satisfy the following relational expression.
Thermal expansion coefficient of resin structure (10) ≤ Thermal expansion coefficient of adjusting region (25) ≤ Thermal expansion coefficient of internal electrode (23)
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Inventors:
NOMIYA MASATO (JP)
Application Number:
PCT/JP2017/046431
Publication Date:
July 05, 2018
Filing Date:
December 25, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/02; H05K3/46; H01L23/12; H01L25/10; H01L25/11; H01L25/18; H03H7/01
Foreign References:
| JP2002100874A | 2002-04-05 | |||
| JP2004304159A | 2004-10-28 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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