Title:
ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/215463
Kind Code:
A1
Abstract:
In an electronic component, a chip has a functional unit that vibrates, and a terminal, on a first surface. An intermediate member is overlapped onto the first surface. The intermediate member has a first through hole above the functional unit, and surrounds the functional unit in plan view of the first surface. A lid body is overlapped onto the surface of the intermediate member on the opposite side from the chip so as to cover the first through hole. A bonding material has an upper end part located on the opposite side from the intermediate member with respect to the lid body. The intermediate member surrounds the terminal as well as the functional unit, due to the first through hole being located above the terminal as well. The lid body has a second through hole overlapping with the terminal, from among the functional unit and the terminal. The bonding material has an intermediate part located in the second through hole, and a lower end part located in the first through hole and bonded to the terminal.
Inventors:
OIKAWA AKIRA (JP)
Application Number:
PCT/JP2021/016134
Publication Date:
October 28, 2021
Filing Date:
April 21, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/04; H01L23/12; H03H3/08; H03H9/25
Foreign References:
| JP2007516602A | 2007-06-21 | |||
| JP2006128327A | 2006-05-18 | |||
| JP2014222860A | 2014-11-27 | |||
| JPH0865093A | 1996-03-08 |
Attorney, Agent or Firm:
IIJIMA, YASUHIRO (JP)
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