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Title:
ELECTRONIC COMPONENT ENCAPSULATING BODY MANUFACTURING METHOD AND ELECTRONIC COMPONENT ENCAPSULATING BODY
Document Type and Number:
WIPO Patent Application WO/2005/096373
Kind Code:
A1
Abstract:
After forming an unwelded part in a primary welding process step (S203) composed of a first beam irradiation process step (S203a) and a second beam irradiation process step (S203b), a prescribed part on an electronic beam trajectory formed in the first beam irradiation process step (S203a) is irradiated with electronic beams in an anneal process step (S204) to be anneal processed. Thus, gas is prevented from being encapsulated in a container, encapsulation in a high vacuum status is made possible and a method for manufacturing an electronic component encapsulating body with an improved manufacturing efficiency is provided.

Inventors:
KIGAWA KEISUKE (JP)
HIRATSUKA HARUYUKI (JP)
WADA TOMOHISA (JP)
Application Number:
PCT/JP2005/006193
Publication Date:
October 13, 2005
Filing Date:
March 30, 2005
Export Citation:
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Assignee:
CITIZEN WATCH CO LTD (JP)
MIYOTA KK (JP)
KIGAWA KEISUKE (JP)
HIRATSUKA HARUYUKI (JP)
WADA TOMOHISA (JP)
International Classes:
H01L23/02; H01L21/50; H03H3/02; H03H9/02; H03H9/10; (IPC1-7): H01L23/02; H03H3/02; H03H9/02
Foreign References:
JP2000277639A2000-10-06
JPH05243411A1993-09-21
JP2003283287A2003-10-03
JP2002141427A2002-05-17
JP2002359311A2002-12-13
Attorney, Agent or Firm:
Sakai, Akinori (19F Kasumigaseki Building, 2-5, Kasumigaseki 3-chom, Chiyoda-ku Tokyo 19, JP)
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