Title:
ELECTRONIC COMPONENT HOLDING JIG, AND METHOD FOR MANUFACTURING SAID ELECTRONIC COMPONENT HOLDING JIG
Document Type and Number:
WIPO Patent Application WO/2018/088299
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an electronic component holding jig in which laser light (L) is irradiated on an elastomer sheet (3), whereby retaining holes (4) for retaining electronic components are formed in the elastomer sheet (3), wherein the method for manufacturing an electronic component holding jig is characterized in that the laser light (L) emitted from a laser oscillator passes through a mask pattern having transmission holes that correspond to the shape of the formed retaining holes (4), and after furthermore being condensed by a lens, the laser light (L) is irradiated on the elastomer sheet (3).
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Inventors:
HAYASHI KIYOSHI (JP)
HOZUMI SATOSHI (JP)
HOZUMI SATOSHI (JP)
Application Number:
PCT/JP2017/039545
Publication Date:
May 17, 2018
Filing Date:
November 01, 2017
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
H01G13/00; B23K26/066; B23K26/382
Foreign References:
| JP2006502006A | 2006-01-19 | |||
| JPH11347766A | 1999-12-21 | |||
| JPS4726792B1 | 1972-07-19 | |||
| JP2015002268A | 2015-01-05 | |||
| JPH0214508A | 1990-01-18 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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