Title:
ELECTRONIC COMPONENT HOUSING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/017441
Kind Code:
A1
Abstract:
An electronic component housing package according to the present invention includes: a base section having a mounting section for an electronic component; a projecting part that is located on the base section and that projects from the base section; a frame part that is located on the base section so as to surround the mounting section; a frame-shaped metallized layer that is located on the frame part; a plurality of external connection conductors that are located on the opposite side from the mounting section in the thickness direction; a connection conductor that is located on the projecting part and to which the electronic component is connected; and a wiring conductor that is connected to the connection conductor and that is led out to the base section. The thickness of the connection conductor becomes progressively larger from the opposite side from the wiring conductor towards the wiring conductor side.
Inventors:
FUKUSHIGE MOTOKI (JP)
SAWADA KEISUKE (JP)
SAWADA KEISUKE (JP)
Application Number:
PCT/JP2018/027147
Publication Date:
January 24, 2019
Filing Date:
July 19, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H03H9/02; H03H9/10
Foreign References:
| JP2016021768A | 2016-02-04 | |||
| JP2003318692A | 2003-11-07 | |||
| JP2016123114A | 2016-07-07 | |||
| JP2000353919A | 2000-12-19 | |||
| JP2009016951A | 2009-01-22 | |||
| JP2013207527A | 2013-10-07 |
Other References:
See also references of EP 3657674A4
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