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Title:
ELECTRONIC COMPONENT JOINT MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/019414
Kind Code:
A1
Abstract:
The present invention mainly addresses the problem of producing an electronic component joint material which can be cured at a low temperature and contains CNTs that can achieve high electrical conductivity. According to the present invention, an electronic component joint material can be produced using a curable resin having flexibility by dispersing and developing carbon nanotubes in the resin and adding an acid anhydride as a curing agent, an organic acid as a curing accelerator and electrically conductive particles to the resin properly.

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Inventors:
NOMI TAKUMI (JP)
MIZOWAKI TOSHIO (JP)
ISEKI HIROAKI (JP)
KOROKI MOTOKI (JP)
Application Number:
PCT/JP2013/071227
Publication Date:
February 12, 2015
Filing Date:
August 06, 2013
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/04; H01B1/22
Foreign References:
JP2006120665A2006-05-11
JP2007149522A2007-06-14
JP2008293821A2008-12-04
JP2009117340A2009-05-28
JP2012079682A2012-04-19
JPH09104855A1997-04-22
US5575956A1996-11-19
JP2012092201A2012-05-17
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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