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Patent Searching and Data


Title:
ELECTRONIC COMPONENT MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/013237
Kind Code:
A1
Abstract:
This electronic component manufacturing device has: holding members (20, 23) that hold an electronic component body (1); a surface plate (100); a moving means (50) for moving the holding members and the surface plate relative to each other; and a control means (90) for controlling the moving means. The control means (90) simultaneously executes a distance changing movement and a position changing movement. The distance changing movement reduces or extends the distance between each of the end faces (2A) of the electronic component body (1) and the surface (101) of the surface plate (100). The position changing movement changes the two-dimensional position of the end face (2A) of the electronic component body (1) as projected onto the surface (101) of the surface plate (100), so that the direction in which the two-dimensional position moves in parallel with the surface (101) of the surface plate (100) changes sequentially (for example, in a circular trajectory).

Inventors:
SATO EIJI (JP)
SAKAMOTO HITOSHI (JP)
Application Number:
PCT/JP2019/027369
Publication Date:
January 16, 2020
Filing Date:
July 10, 2019
Export Citation:
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Assignee:
CREATIVE COATINGS CO LTD (JP)
International Classes:
H01G4/30; H01C7/02; H01C7/04; H01C17/28; H01F41/10; H01G13/00
Domestic Patent References:
WO2018070093A12018-04-19
Foreign References:
JP2016100459A2016-05-30
JPH05182879A1993-07-23
JPH04291712A1992-10-15
JP2009164190A2009-07-23
JP2016082209A2016-05-16
JPH04263414A1992-09-18
JPH03267170A1991-11-28
JPS5987073A1984-05-19
JP2016137437A2016-08-04
Attorney, Agent or Firm:
INOUE Hajime et al. (JP)
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