Title:
ELECTRONIC COMPONENT MANUFACTURING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198710
Kind Code:
A1
Abstract:
An electronic component manufacturing method comprising: a first step of causing an electronic component body (1) and a surface plate (100) to be moved relative to each other, causing the electronic component body (1) to contact a dip layer (3) of an electrically conductive paste applied to a major surface (101) of the surface plate (100), and applying the electrically conductive paste to an end part (2) of the electronic component body (1); a second step of causing the electronic component body (1) to be separated from the dip layer (3) on the surface plate (100) by relative movement of the electronic component body (1) and the surface plate (100), and forming an electrically conductive paste layer (4) on the electronic component body (1); and, thereafter, a third step of causing the electrically conductive paste layer (4) applied to an end face (2A) of the electronic component body (1) to contact a wire material (5) that vibrates due to sound waves.
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Inventors:
SATO EIJI (JP)
Application Number:
PCT/JP2019/015461
Publication Date:
October 17, 2019
Filing Date:
April 09, 2019
Export Citation:
Assignee:
CREATIVE COEM CO LTD (JP)
International Classes:
H01G4/30; H01F41/04; H01G13/00
Foreign References:
| JP2016100459A | 2016-05-30 | |||
| JP2015167175A | 2015-09-24 | |||
| JP2008153310A | 2008-07-03 | |||
| JPH0837136A | 1996-02-06 | |||
| JP2007123355A | 2007-05-17 |
Attorney, Agent or Firm:
INOUE Hajime et al. (JP)
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