Title:
ELECTRONIC COMPONENT METAL MATERIAL AND MANUFACTURING METHOD THEREOF, AND CONNECTOR TERMINAL, CONNECTOR AND ELECTRONIC COMPONENT USING SAID ELECTRONIC COMPONENT METAL MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/003145
Kind Code:
A1
Abstract:
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal using said electronic component metal material, and a connector terminal, a connector and an electronic component using said electronic component metal material are provided. This electronic component metal material is provided with: a substrate; a lower layer formed on the substrate and configured from one or more elements selected from constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu; a middle layer formed on the lower layer and configured from one or more elements selected from constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; an upper layer formed on the middle layer and configured from an alloy of one or more elements selected from constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and one or two elements selected from constituent element group C consisting of Sn and In; and a topmost layer formed on the upper layer and configured from one or two elements selected from constituent element group C consisting of Sn and In. The thickness of the lower layer is greater than or equal to 0.05μm and less than 5.00μm, the thickness of the middle layer is greater than or equal to 0.01μm and less than 0.50μm, the thickness of the upper layer is less than 0.50μm, and the thickness of the topmost layer is greater than or equal to 0.005μm and less than 0.30μm.
Inventors:
SHIBUYA YOSHITAKA (JP)
FUKAMACHI KAZUHIKO (JP)
KODAMA ATSUSHI (JP)
FUKAMACHI KAZUHIKO (JP)
KODAMA ATSUSHI (JP)
Application Number:
PCT/JP2013/067728
Publication Date:
January 03, 2014
Filing Date:
June 27, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/00; C22C5/02; C22C5/04; C22C5/06; C22C13/00; C22C28/00; C25D5/10; C25D5/50; H01B1/02; H01B5/02; H01R13/03
Foreign References:
| JP2012036436A | 2012-02-23 | |||
| JP2010138452A | 2010-06-24 | |||
| JP2011026677A | 2011-02-10 | |||
| JP2005353542A | 2005-12-22 | |||
| JPH11350189A | 1999-12-21 | |||
| JP2010262861A | 2010-11-18 | |||
| JPH05311495A | 1993-11-22 | |||
| JPH04370613A | 1992-12-24 | |||
| JPH11350189A | 1999-12-21 | |||
| JP2005126763A | 2005-05-19 |
Other References:
See also references of EP 2868776A4
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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