Title:
ELECTRONIC COMPONENT AND METHOD FOR MAKING SAME
Document Type and Number:
WIPO Patent Application WO/2022/244313
Kind Code:
A1
Abstract:
Provided is an electronic component in which the enhancement of the strength of the junction between an external electrode and a plating layer as well as the strength of the junction between the external electrode and an internal conductor has been achieved. An electronic component 10 according to the present invention comprises: an element assembly 20; an inter-layer connecting conductor 33 that extends, in the element assembly 20, to a main surface 20A thereof; an external electrode 51 that is formed on the main surface 20A of the element assembly 20 to cover the inter-layer connecting conductor 33; and a plating layer 60 that covers the external electrode 51. The plating layer 60 has impregnation parts 60A with which the inter-layer connecting conductor 33 is impregnated.
Inventors:
OIE HIROFUMI (JP)
Application Number:
PCT/JP2022/003150
Publication Date:
November 24, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/228; H01F27/29
Domestic Patent References:
| WO2017179325A1 | 2017-10-19 |
Foreign References:
| JP2020167376A | 2020-10-08 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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