Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/172939
Kind Code:
A1
Abstract:
Air can be prevented from remaining in the solder connecting a land of a circuit board and an external electrode.
A stacked body (12) is configured by stacking a plurality of rectangular insulating layers (16) and has a mounting surface (S1) constituted by the sides of the insulating layers (16) that stand in a row. A dummy lead-out conductor (20) and a lead-out conductor (22) are exposed from between the insulating layers (16) in the mounting surface (S1). An external electrode (14a) covers the dummy lead-out conductor (20) and the lead-out conductor (22) in the mounting surface (S1). In the mounting surface (S1), a formation region (A1) in which the external electrode (14a) is provided is curved so that the center of the formation region (A1) protrudes from both ends thereof, when viewed in a planar view from an extension direction along which the sides of the insulating layers (16) constituting the mounting surface (S1) extend.
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Inventors:
ODAHARA MITSURU (JP)
Application Number:
PCT/JP2012/063128
Publication Date:
December 20, 2012
Filing Date:
May 23, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
ODAHARA MITSURU (JP)
ODAHARA MITSURU (JP)
International Classes:
H01F17/00; H01F41/04
Foreign References:
JP2007096215A | 2007-04-12 | |||
JP2010080703A | 2010-04-08 | |||
JP2004200373A | 2004-07-15 | |||
JP2009111314A | 2009-05-21 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
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Claims: