Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/103113
Kind Code:
A1
Abstract:
Provided is an electronic component capable of establishing a highly reliable connection with a via hole conductor penetrating a resin layer formed so as to cover a wiring board and a conductor pattern formed on the wiring board. The electronic component (10) includes the wiring board (12). A recess (18), included in a stress relief structure, is formed on a conductor pattern (16a) for the via hole conductor, on one principal surface side of the wiring board (12). An electronic component element (20) is surface-mounted on the one principal surface side of the wiring board (12). The electronic component element (20) and the one principal surface of the wiring board (12) are covered by a resin layer (24). A via hole conductor (28) is formed in the resin layer (24) so as to penetrate the resin layer (24). The via hole conductor (28) is connected to the conductor pattern (16a). A connecting portion (30) between the via hole conductor (28) and the conductor pattern (16a) for the via hole conductor are formed in the recess (18) on the wiring board (12).
Inventors:
NAGANO TAKAYUKI (JP)
NOMIYA MASATO (JP)
NOMIYA MASATO (JP)
Application Number:
PCT/JP2012/083610
Publication Date:
July 11, 2013
Filing Date:
December 26, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01L23/12; H01L23/14; H01L23/15
Foreign References:
| JP2011009327A | 2011-01-13 | |||
| JP2011108960A | 2011-06-02 | |||
| JP2011044523A | 2011-03-03 | |||
| JP2011138890A | 2011-07-14 |
Attorney, Agent or Firm:
OKADA, MASAHIRO (JP)
Zenkei Okada (JP)
Zenkei Okada (JP)
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Claims:
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