Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/146979
Kind Code:
A1
Abstract:
[Problem] To provide an electronic component and method for manufacturing same that do not require a jig for securing a metal terminal and electronic component body in place, and can be employed using a jig of simple construction if so required. [Solution] An electronic component (1) provided with: an electronic component body (2) including a top face (2a), a bottom face (2b), a pair of side faces (2c), and a pair of end faces (2d) provided with an outside electrode (3); and a pair of metal terminals (4) individually connected to the pair of outside electrodes (3) of the electronic component body (2), wherein a connector (6) on the metal terminals (4) is electrically and mechanically connected to the outside electrode (3) of the electronic component body (2), and a bottom contact unit (5) is in contact with the bottom face (2b) of the electronic component (2).
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JPH02260620 | METHOD OF MOUNTING CHIP-LIKE CAPACITOR |
Inventors:
ORIMO HIROKAZU (JP)
Application Number:
PCT/JP2013/059183
Publication Date:
October 03, 2013
Filing Date:
March 28, 2013
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01G2/06; H01G4/228; H01G4/232; H01G4/30
Foreign References:
JP2010177370A | 2010-08-12 | |||
JPH065478A | 1994-01-14 |
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