Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/244335
Kind Code:
A1
Abstract:
This electronic component comprises: a plurality of base materials laminated in the thickness direction; an inter-layer connection conductor filled into a through-hole that is provided in each of the base materials and that penetrates the base material in the thickness direction; and an inner electrode formed via the inter-layer connection conductor and the base materials at a position overlapping the inter-layer connection conductor when viewed in the thickness direction. The inter-layer connection conductor has a cavity. The cavity is formed to be deviated toward the inner electrode side in the thickness direction of the through-hole.
Inventors:
OIE HIROFUMI (JP)
OTSUBO YOSHIHITO (JP)
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2022/004716
Publication Date:
November 24, 2022
Filing Date:
February 07, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/29; H01G4/30; H01G4/33; H01G4/38; H05K3/46
Domestic Patent References:
| WO2012108381A1 | 2012-08-16 | |||
| WO2011058938A1 | 2011-05-19 |
Foreign References:
| JP2011077158A | 2011-04-14 | |||
| JP2013074262A | 2013-04-22 | |||
| JP2015060981A | 2015-03-30 | |||
| JP2013197548A | 2013-09-30 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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